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Paketleme: 50 ML


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Üretici: Hernon

TDS:

Tuffbond ® 322 is a transparent 1: 1 flexible, low viscosity, general purpose resin system used for casting, coating and encapsulation of electrical and electronic components. This unique product has been formulated to combine ease of use with optimum physical, thermal and electrical insulating properties.


Typical applications

  • Potted electronic cards

  • Pottery battery components

  • Encapsulation of electrical and electronic components

  • Transformers

  • Coils and coils

  • Solenoids

  • Micro circuit

Paketleme 50 ML
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