Dissipator ® 745 is a thermally conductive, room temperature curing adhesive designed to bond electrical components to the heatsink with a controlled gap. Dissipator ® 745 provides thermal conductivity while electrically insulating the component thanks to a special polishing feature. This special polishing feature creates a constant gap between components from 0.005 inch to 0.006 inch.
| Packing | 25 ML |