Momentive SilCool TIA208R is a two-component, thermally conductive silicone for potting and gap filling. It cures at room temperature, or quickly with heat, to a thermally conductive rubber that adheres well to most metal and plastic substrates without primers. Its flowability lets it conform to complex three-dimensional shapes and cavities, filling voids and creating a thermal path.
Features
- Two-component, room-temperature or heat cure
- Primerless adhesion to most metals and plastics
- Flowable; fills complex cavities
Notes
- Typical property values are given in the Momentive technical data sheet; contact us for current specification approvals.
| Packing | 1.5 KG + 1.5 KG Kit or 25KG + 25 KG Kit |