3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 is a two-part, low-viscosity epoxy system designed for potting, sealing and encapsulation of electronic components. It is noncorrosive to copper, offers good thermal shock resistance and retains electrical insulation under high humidity.
Features
- Good thermal shock resistance; excellent electrical properties
- Noncorrosive to copper; negligible exotherm
- Long work life (60–70 min)
- Meets UL 94 HB (File E61941)
Applications
- Potting and encapsulation of sensors, glass diodes and delicate components
- Transformers, coils, chokes and relays
Specifications
- Color: clear or black
- Mix ratio: 1:1 by volume (1:0.85 B:A by weight)
- Tack-free: approx. 3 h; full cure: 48 h at 23 °C
- Viscosity at 23 °C: base 7,000–16,000 cps; accelerator 6,000–12,000 cps
| Packing | 48.5 ML |