DEVCON Epoxy 14210

Devcon 5 Minute Epoxy is a rapid curing, general purpose adhesive and encapsulant that forms a hard, rigid bond or coating in minutes. It is 100% reactive with no solvents and has good dielectric strength and solvent resistance. It is used for quick metal to metal bonding and repairs, for potting and encapsulating electronic components and assemblies, and for bonding metals, fabrics, ceramics, glass, wood and concrete (in combinations). 14210 is the 70 g twin tube.

Typical Properties

• Light amber; mixed viscosity 10,000 cP; mix ratio by volume and weight 1:1; mixed density 1.10 g/cm³
• Working time (28 g, 23 °C) 3–6 min; fixture time 10–15 min; functional cure (23 °C) 45–60 min; full cure 12 hours
• After 7 days cure at 24 °C: tensile shear (ASTM D1002) 13 MPa; T-peel 4–5 N/10 mm; hardness 85 Shore D
• Dry service temperature −40 to 93 °C; dielectric strength (ASTM D149) 19.6 kV/mm; solids by volume 100%

Use and Storage

• Surfaces must be free of grease, oil, dirt and contaminants; abrading metal surfaces increases bond strength
• Apply the mix to one surface as an even film or bead and assemble within the working time; do not load before the functional cure time
• 3 years from date of manufacture at room temperature (22 °C) in the original containers