Devcon 5 Minute Epoxy is a rapid-curing, general-purpose adhesive and encapsulant. It is 100 % reactive with no solvents and bonds metals, fabrics, ceramics, glass, wood and concrete in combinations.
Features
- 100 % reactive, no solvents
- Good solvent resistance
- Working time 3–6 min; fixture 10–15 min
Applications
- Bonding metals, fabrics, ceramics, glass, wood and concrete
- General-purpose encapsulation
Specifications
- Mix ratio: 1:1 by volume and weight
- Functional cure: 0.75–1 h; full cure: 12 h
- Tensile lap shear (ASTM D1002): 13.1 MPa (1,900 psi)
- Hardness: Shore D 85; dielectric strength: 19.3 kV/mm
- Service temperature (dry): -40 °C to 93 °C
| Packing | 25 ML or 250 ML |