Hernon® Dissipator 745 is a thermally conductive, room-temperature-curing adhesive designed for bonding electrical components to heat sinks with a controlled gap. A special shimming property produces a constant gap of 0.13–0.15 mm (0.005–0.006 in) between components, insulating the component electrically while allowing thermal conductivity.
Benefits
- No mixing required (no mix ratio errors); no heat cure required
- Eliminates screws and rivets for assembly; eliminates the air space between components
- High k factor for heat-conductive applications
Typical Properties
- Chemical type: modified acrylic; appearance: light blue paste; specific gravity 1.63
- Viscosity at 25 °C: 300,000–800,000 cP
- Thermal conductivity 0.927 W/(m·K) (ASTM C177); temperature range −55 to 150 °C (−65 to 300 °F)
- Dielectric constant (1 kHz) 4.60
- Fixtures in under 5 minutes at room temperature with Activator 63; full cure in 4–24 hours
Shear Strength (ISO 4587, Activator 63 on one surface, 22 °C)
- 1 hour, steel: ≥3.4 N/mm² (≥500 psi)
- 72 hours: steel ≥17.2 N/mm² (≥2500 psi); aluminium ≥13.8 N/mm² (≥2000 psi); aluminium to epoxy glass ≥2.06 N/mm² (≥300 psi)
Directions for Use and Storage
- Surfaces must be clean and free of grease; apply activator to one surface (stays active up to 2 hours) and adhesive to the other
- Secure the assembly and allow about 5 minutes to fixture; apply only enough to fill the bond and form a small fillet
- 7–29 °C (45–85 °F) in unopened containers
| Packing | 25 ML |