Hernon® Dissipator 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room-temperature cure, excellent heat dissipation for thermally sensitive components and controlled strength for service repair make it a replacement for tapes, epoxies, silicones, fasteners and mechanical clips.
Typical Applications
- Bonding transformers, transistors and other heat-generating electronic components to printed circuit board assemblies or heat sinks
Typical Properties
- Chemical type: modified acrylic; appearance: white paste; specific gravity 1.64
- Thermal conductivity 0.92 W/(m·K) (ASTM C177); temperature range −55 to 150 °C (−65 to 300 °F)
- Dielectric constant (1 kHz) 5.29
- Fixtures in under 5 minutes at room temperature with Activator 63; full cure in 4–12 hours
Shear Strength (ASTM D1002, Activator 63 on one surface, 22 °C)
- 1 hour, grit-blasted steel: ≥3.4 N/mm² (≥500 psi)
- 72 hours: steel ≥15.1 N/mm² (≥2200 psi); aluminium ≥13.7 N/mm² (≥2000 psi)
Directions for Use
- Surfaces must be clean and free of grease; apply activator to one surface (stays active up to 2 hours) and adhesive to the other
- Secure the assembly and allow about 5 minutes to fixture; apply only enough to fill the bond and form a small fillet
- Repair: bond strength drops at about 65–93 °C, so components can be removed while hot with a hot-air jet
Storage
- 7–29 °C (45–85 °F) in unopened containers
| Packing | 25 ML |