DOWSIL™ 340 Heat Sink Compound is a white, non-curing and non-flowing thermally conductive compound. It is a grease-like silicone material consisting of polydimethylsiloxane and heat-conductive zinc oxide. It promotes high thermal conductivity, low bleed and high temperature stability. It is used for thermal coupling of electrical devices and PCB assemblies to heat sinks or chassis; heat flow away from components can increase reliability. It needs no ovens or curing and is applied by manual or automated dispensing.
Typical Properties
- One part; white; viscosity 542,000 cP; specific gravity 2.1
- Thermal conductivity 0.67 W/m·K; thermal resistance (40 psi) 0.16 °C·cm²/W
- Worked penetration 290 (1/10 mm); bleed 0.23%; evaporation 0.38%
- Shelf life (38 °C) 60 months
Use
- Resistant to minimal or intermittent solvent exposure; avoiding solvent exposure altogether is recommended
- Store in the original packaging with the cover tightly attached
| Packing | 120 GR |