LOCTITE SF 7649 is a solvent based activator for surface preparation providing low temperature curing.
LOCTITE® SF 7649 is designed to increase the curing rate of LOCTITE anaerobic adhesives and sealants without a significant loss of joint strength. Especially recommended for applications involving passive metals or inert surfaces and large bonding gaps. LOCTITE SF 7649 performs well at low curing temperatures and is recommended when the application temperature is below 15 ° C.
Increases curing speed on passive and inactive surfaces
For large bonding gaps
For low temperature (<5 ° C) curing
| Technical Data | |
|---|---|
| Viscosity 25°C mm2/s | 2 |
| Chemical Composition | Copper salt and aliphatic amine |
| Storing Temperature | Room temperature |
| Application | Activator |
| Applicable Surfaces | Metal: steel, stainless steel, brass |
| General | |
| Packing | 150 ML |
| Color | Transparent |