Hernon® Tuffbond 302 is a modified epoxy adhesive with a very fast room-temperature cure and very good moisture, chemical and heat resistance. Formulated for rapid in-line assembly, it bonds metals, wood and ceramics and is used for potting and encapsulating electrical and electronic components.
Typical Applications
- Loudspeaker voice coil to cone and pole piece to magnet bonding; bonding alnico magnets to bases
- Rapid-curing structural and electrical repair kits; laminates and gel coats
- Potting electronic boards; encapsulating electrical and electronic components
Typical Properties
- Part A epoxy (white), Part B amine (clear–light amber); mix ratio by weight 1:1
- Viscosity at 25 °C: 50,000–60,000 cP (each part); specific gravity A 1.18, B 1.13
- Working life at 22 °C (20 g): ≤5 minutes
- Cured: hardness 85–90 Shore D; Tg 52 °C; operating temperature −54 to 85 °C; thermal conductivity 0.567 W/(m·K)
Shear Strength (ASTM D1002, 24 h at 22 °C)
- Aluminium: 1000–2000 psi
- Steel: 1500–2500 psi
Benefits
- Fast room-temperature cure (about 5 minutes); low shrinkage
- 100% reactive, solvent-free; easy mix ratio; no fuming on gelation
Storage
- 7–29 °C (45–85 °F) in unopened containers; not for pure oxygen or oxygen-rich systems
| Packing | 50 ML or 400 ML |