Hernon® Tuffbond 313 is a two-component, 100% solids epoxy adhesive/sealant with a 1:1 mix ratio and room-temperature cure. It bonds metals, wood and ceramics and is used for potting and encapsulating electrical and electronic components, offering good mechanical properties, outstanding abrasion resistance and non-critical mixing.
Typical Properties
- Part A epoxy, Part B amine; mix ratio by weight 1:1; mixed colour amber
- Viscosity at 25 °C: 18,000–26,000 cP (each part); specific gravity A 1.17, B 0.97
- Working life at 22 °C (100 g): 40–60 minutes
- Cured: hardness 70–80 Shore D (ASTM D2240); dielectric constant at 1 kHz 3.38
Shear Strength (ASTM D1002, grit-blasted steel)
- Room temperature: 2500–4000 psi
- At 0.25 mm gap, tested at temperature: −55 °C 1300–2000 psi; 23 °C 1000–1500 psi; 80 °C and 155 °C 150–400 psi
Typical Applications
- Marine and underwater coating
- Potting electronic boards; encapsulating electrical and electronic components
Storage
- 7–29 °C (45–85 °F) in unopened containers
| Packing | 50 ML or 400 ML |