Hernon Tuffbond 321 is a flexible, low viscosity, general purpose epoxy resin system used for casting, potting and encapsulating electrical and electronic components. It is formulated to combine ease of handling with good physical, thermal and electrical insulation properties. The two-component system mixes 1:1 by weight and cures to a clear, flexible material, at room temperature or with heat.
Applications
- Potting electronic boards and encapsulating electrical and electronic components
- Transformers, coils and chokes, solenoids, micro circuitry
Typical Properties
- Part A: epoxy, clear; Part B: modified mercaptan, light yellow
- Viscosity (25 °C, each part): 10,000–16,000 cP
- Mix ratio (by weight, A:B): 1 : 1
- Working life (22 °C, 100 g): 3–4 hours
- Hardness (24 hours): 25–35 Shore A
- Elongation at break (ASTM D638): 189.34%
- Lap shear strength (ASTM D1002, cured 24 hours at 22 °C): 100–500 psi on grit-blasted steel, grit-blasted aluminium and FR-4
Application
- Make sure parts are clean and dry; mix Part A and Part B until uniform and apply to the prepared surfaces
- Not recommended for use in pure oxygen and/or oxygen rich systems, and not to be selected as a sealant for chlorine or other strong oxidizing materials
Cure
- Cure time at 22 °C (100 g): 24 hours
Packaging and Shelf Life
- Store in a cool, dry location in unopened containers at 7–29 °C (45–85 °F) unless otherwise labeled
| Packing | 50 ML |