Hernon® Tuffbond® 322 is a transparent, 1:1, flexible, low-viscosity epoxy resin system for casting, potting and encapsulating electrical and electronic components, combining easy handling with good physical, thermal and electrical insulation properties.
Features
- Low viscosity, low shrinkage
- 1:1 mix ratio by volume
- Room temperature or heat cure
- Suitable for metals, PVC and phenolics
Applications
- Potting of electronic boards and battery components
- Encapsulation of transformers, coils, chokes and solenoids
- Micro-circuitry
| Packing | 50 ML |