Hernon® Tuffbond 322 is a transparent, 1:1 by volume, flexible, low viscosity, general purpose resin system used for casting, potting and encapsulating electrical and electronic components. It combines ease of handling with optimum physical, thermal and electrical insulation properties.
Typical Applications
- Potting electronic boards and battery components; encapsulating electrical and electronic components
- Transformers, coils and chokes, solenoids, micro circuitry
Benefits
- Low viscosity; low shrinkage; room temperature or heat curing
- Can be used on metals, PVC and phenolics
Typical Properties
- Part A epoxy (clear pale yellow), Part B modified amine (pale yellow); mix ratio by volume 1:1
- Viscosity at 25 °C: A 10,000–16,000 cP, B 12,000–18,000 cP; specific gravity A 1.16, B 1.15
- Working life (22 °C, 30 g) 3–4 hours; hardness 25–45 Shore A
- Shear strength (ASTM D1002, grit-blasted steel, 24 hours at room temperature) 300–1,000 psi
Use and Storage
- Parts must be clean and dry; dispense through a static mixer or mix A and B until thoroughly blended
- Cool, dry location in unopened containers at 20–30 °C (68–86 °F)
| Packing | 50 ML |