Hernon® Ultrabond 758 is a low-viscosity, self-levelling, UV-curable potting compound formulated for high-performance, fast-curing coating and encapsulation of electronic components, and is also used for shallow potting. It cures rapidly at room temperature under high-intensity UV light (365 nm).
Typical Properties (uncured)
- Chemical type: modified acrylic ester; appearance: clear liquid
- Specific gravity at 25 °C 1.04; viscosity at 25 °C 270–350 cP
- At 100 mW/cm², 365 nm: fixture time (glass) 5 s; tack-free <20 s
Typical Properties (cured)
- Tensile strength 3250 psi; modulus 108,000 psi; elongation 85% (ASTM D638); hardness 95 Shore B
- Temperature range: −54 to 177 °C (−65 to 350 °F)
- Dielectric strength 36 kV/mm; dielectric constant (1 kHz) 4.25; volume resistivity 1.7×10¹⁵ Ω·cm
- Block shear strength (ASTM D4501, 20 s cure): glass–glass ≥1000 psi; glass–steel ≥400 psi
Benefits
- UV fluorescence for in-process inspection; 100% solids, solvent-free; no shrinkage
- Excellent adhesion to a variety of surfaces, environmental resistance and good gap filling
Use and Storage
- Dark surfaces, thicker films and distance from the UV source lengthen cure; check lamp output with a radiometer
- Not for pure oxygen or oxygen-rich systems
- 7–29 °C (45–85 °F) in unopened containers
| Packing | 50 ML |